Intel just announced the latest member of its 8th Gen Core processor family. The new 8th Gen Intel Core i3 processor is designed to power mainstream laptops and 2-in-1s.
Unlike other members of the 8th Gen, which have 4 cores, the new i3 has just 2 cores. But like them, the new CPU also uses Intel’s current 14nm lithography.
Still, the 8th Gen i3 offers a performance gain over its predecessor, Intel’s 7th Gen i3-7130U. That previous processor had a peak rating of 2.7 GHz. By contrast, the new i3-8130U processor actually has a lower base speed of 2.2 GHz. But with Intel Turbo Boost Technology 2.0, the new i3 can speed up to 3.4 GHz. That’s nearly 30% higher than the 7th Gen i3’s peak.
To keep laptop batteries humming along for up to 10 hours without a charge, the new Intel processor is a low-power device with a TDP of 15 watts.
The new i3 also supports Intel Optane memory, a cache of up to 4MB, and memory up to 32GB.
Pricing hasn’t been announced yet. But Intel says new laptops and 2-in-1s powered by the new 8th Gen Intel Core i3 should be coming from hardware partners “soon.”
Other features of the new 8th Gen Intel Core i3 are said by Intel to include:
> Faster performance: The processor’s higher speed should translate into faster movement among windows and applications, seamless photo and video editing, and faster completion of everyday computing tasks.
> Better entertainment: Intel says the new i3 will be ideal for 4K UHD video streaming, VR applications, and online gaming.
> Improved security: The processor features built-in security protection and supports Windows 10’s biometric logins.
What’s next? Last August, when Intel announced the first 8th Gen processors, the company’s GM of client computing, Gregory Bryant, wrote in an online editorial that some the 8th Gen “will even include some of our first 10 nm products.”
Learn more: Check out the 8th Gen Intel Core i3 product specs and technical specifications.
List of Intel Core i3 processors
- SR1PJ (C0)
- SR1KP (C0)
- SR1PK (C0)
- SR1KQ (C0)
- SR1PL (C0)
- SR1KR (C0)
- SR1PF (C0)
- SR1K1 (C0)
- SR1PD (C0)
- SR1JZ (C0)
- SR1PC (C0)
- SR1JY (C0)
- SR1PG (C0)
- SR1KM (C0)
- SR1PH (C0)
- SR1KN (C0)
- SR1PB (C0)
- SR1JV (C0)
- SR1PA (C0)
- SR1JU (C0)
- Ww2 german militaria dealers
- Hummer h1 performance parts
- Sun sign horoscope today
- Rev a shelf ikea
- Gearwrench ratchet 90 tooth
Intel Core i3-8130U 8th Gen Dual-Core Laptop CPU
The 8th Generation Intel Core i3-8130U is a mid-range dual-core laptop processor. The previous generation Core i3 chips are lower-mid-range CPUs and the i3-8130U is noticeably faster than them, so it is a mid-tier model. This advancement is enabled primarily with help of Intel’s TurboBoost technology, which is lacking on the 7th Gen and older i3 counterparts. TurboBoost allows big clock speed bursts – in this case from default 2.2 GHz up to 3.4GHz, in situations when a computing task requires that.
Intel Core i3-8130U CPU Benchmark
Advantage of the Intel Core i3-8130U over its i3-7100U precursor, as well as other 7th Gen CPUs, is very visible in benchmark results. On the other hand, the i3-8130U noticeably lags behind other 8th Gen Intel Core chips, such as the widely used i5-8250U. That’s primarily because the i5 has four processing cores as opposed to i3’s two cores.
As for real-life use, the Intel Core i3-8130U is an excellent solution for the day-to-day computing tasks – web browsing, work in MS Office and other productivity software, or media playback. Investing in faster 8th Gen i5 and i7 makes sense if you do demanding tasks like video or photo editing on daily basis. In aforementioned routine daily tasks difference between the i3, i5, and i7 is barely noticeable.
As for gaming, the i3-8130U with its Intel UHD 620 integrated graphics is capable of running only light games. But, many of the most popular titles, such as League of Legends or Minecraft, aren’t demanding and they can run on the UHD 620 quite smoothly.
Note: The benchmark scores of the listed processors are averages measured across various devices with these processors. The scores and real-world performance of the Intel Core i3-8130U and compared CPUs may vary depending on the notebooks' other components, settings, cooling, and other factors. However, the benchmark results are good indicators of the processors' performance.
Specifications of the Intel Core i3-8130U
Here's the specs sheet of the Intel Core i3-8130U:
|Processor Name||Intel Core i3-8130U|
|CPU Family||8th Generation Intel Core "Kaby Lake R"|
|Number of Cores||Dual-core / 2 computing threads per core|
|CPU Clock Speed||2.2 GHz - 3.4 GHz|
|Memory Support||DDR3 (2133 MHz max. speed)|
DDR4 (2400 MHz max. speed)
|Integrated Graphics||Intel UHD 620|
|Typical Use||Mainstream laptops & 2-in-1 PCs|
|Notable Technologies||Intel HyperThreading (enables two computing threads per physical processor core)|
Intel QuickSync Video (speeds up conversion of video files)
Intel TurboBoost (dynamically boosts performance of cores, depending on power and thermal headroom)
|Year of Release||2018|
The date the product was first introduced.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ‡
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Processor graphics brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics, and Iris® Pro Graphics. See the Intel® Graphics Technology for more information.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
4K support indicates the product's support of 4K resolution, defined here as minimum 3840 x 2160.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel® InTru™ 3D Technology
Intel® InTru™ 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel® Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
Intel® Clear Video Technology
Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this processor.
Junction Temperature is the maximum temperature allowed at the processor die.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel vPro® Platform Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Transactional Synchronization Extensions
Intel® Transactional Synchronization Extensions (Intel® TSX) are a set of instructions that add hardware transactional memory support to improve performance of multi-threaded software.
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Identity Protection Technology ‡
Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel® Stable Image Platform Program (SIPP)
The Intel® Stable Image Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Intel® Software Guard Extensions (Intel® SGX)
Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Memory Protection Extensions (Intel® MPX) provides a set of hardware features that can be used by software in conjunction with compiler changes to check that memory references intended at compile time do not become unsafe at runtime due to buffer overflow or underflow.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Generation i3 8th
They chased each other. Yeah. I'll go.Intel Core i3-8100 - Best Value Gaming CPU? - Worth It in 2019? (i3 8100 Review \u0026 Benchmarks)
Olya showed me the rooms, then we drank tea, warmed up. Olya showed me her tapes and books. I sprawled imposingly on her bed, covered with a blanket.
You will also like:
- Sofia carson black dress
- Ropa verano 2017 mujer
- Rei paddle board
- Outdoor swings and hammocks
- 5 inch depth shelf
- Hypro spray tips chart
- Samsung mobile transfer app
- Driving range kent wa
- Lone pine obituaries
- Mongoose bike chain size
Them. I behaved the same way with you. We stood there a little longer.